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Jan 04th
Home arrow General collaboration arrow Registration Ramping up for 2008 3D Collaboration & Interoperability Conference

Registration Ramping up for 2008 3D Collaboration & Interoperability Conference

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Sunday, 13 January 2008

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Loveland, CO January 14, 2008 – The organizers of the 2008 3D Collaboration & Interoperability conference are pleased to announce that registration for the 4th annual conference is ramping up.  This year’s conference taking place May 15-16, 2008 at the Denver Athletic Club in Denver, Colorado, is the only CAD conference devoted exclusively to the issues, strategies and best practices for successful collaboration and interoperability with 3D product data.

The 3D Collaboration & Interoperability conference brings together industry leaders and experts from several well-known manufacturers in automotive, aerospace, heavy equipment, high-tech, electronics and other discrete manufacturing industries, along with representatives from the government and defense community.  Attendees take part in industry-leading presentations and highly interactive panel sessions about real-world user experiences and solutions.

To date, sponsors for the 2008 conference include: Adobe Systems, Datakit/Unified CAD, ITI TranscenData, Kubotek America, Lattice Technology, Proficiency, Right Hemisphere and Spatial Corp., TransMagic, Inc., while PDES, Inc. is the first organization to endorse this 4th annual international event.

“We are pleased to be a sponsor for the 2008 3D Collaboration & Interoperability Conference,” said Bill Barnes, Lattice Technology General Manager.  “This event is a unique gathering of the 3D collaboration and interoperability software industry, with highly qualified peers to learn and network with.”

The 2008 3D Collaboration & Interoperability Conference offers highly informative presentations led by the most experienced users and experts in these fields.  Attendees have the unique opportunity to interact directly with fellow users and leading experts in the field, while also learning about the latest data exchange software tools.

The conference organizers continue to seek engineering users to share their experiences in interoperability and collaboration with 3D CAD and manufacturing data.  The call for speakers has been extended through February 1, 2008.  To propose a presentation, or to learn more, please visit www.longviewwadvisors/interopoutboundlink

 
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