WESTMINSTER, CA - (May 5, 2010) - Nei Software will debut Nei Nastran V10 at SAMPE, a materials and processing technology conference being held in Seattle WA between May 18-20. Engineers will be on hand to demonstrate Nei Nastran V10 along with the suite of engineering software solutions offered by Nei Software. In addition, Nei Software will present a new white paper entitled "Simulating Fiber Metal Laminates" on May 20
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WHEN & WHERE
SAMPE 201 Seattle, WA May 18-20, 2010 Visit Nei Software at booth 1610 Washington State Convention Center 800 Convention Place Seattle, WA 98101-2350 Presentation May 20, 2010 at 8:25AM Session: Design & Analysis IV FEA White Paper: "Simulating Fiber Metal Laminates"
About Nei Software
Nei Software is a global provider of Nastran Finite Element Analysis (FEA), engineering simulation, and virtual test software. Engineers gain insight with digital prototypes, images, contour plots, graphs, and animations of linear and nonlinear structural stress, deformation, dynamics, vibration, kinematics, impact, heat transfer and fluid dynamic (CFD) simulations. The website features case studies in aerospace, automotive, maritime, petroleum, medical, and consumer products with demonstration videos, webinars, tutorials, and training schedules.
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