Electrical engineering
ANSOFT HFSS Seminars and Training ANSOFT HFSS Seminars and Training |
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| Wednesday, 21 October 2009 | |
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3D Full-wave Electromagnetic Field Simulation. Come and find out how HFSS 12.0 can massively reduce the time to design and simulate electromagnetic devices. HFSS™ is the industry-standard simulation tool for 3D full-wave electromagnetic field simulation. HFSS 12.0 as part of the Ansoft suite, helps engineers design, simulate and validate the behavior of complex high-performance radio frequency (RF), microwave and millimeter-wave devices in next-generation wireless communication and defense systems. A key high-performance computing (HPC) enhancement, domain decomposition, allows engineers to simulate and design at a scale and speed never before possible. Users of this latest version of HFSS software can achieve a dramatic reduction in development time and costs while at the same time realizing increased reliability and design optimization. LEAP will be conducting live seminars and a training course presenting HFSS V12.0 Updates (including examples) and Tips and Techniques for using HFSS. Seminars will be conducted in Melbourne, Sydney and Adelaide over 9-13 Nov 2009. Training will be undertaken in Brisbane on 11 Nov 2009.
Guest Speaker/Trainer - Arien Sligar, Application Engineer, ANSOFT, USA HFSS OverviewHFSS provides E- and H-fields, currents, S-parameters and near and far radiated field results. Intrinsic to the success of HFSS as an engineering design tool is its automated solution process where users are only required to specify geometry, material properties and the desired output. From here HFSS will automatically generate an appropriate, efficient and accurate mesh for solving the problem using the proven finite element method. With HFSS the physics defines the mesh, not the mesh defining the physics. Using HFSS in your design flow reduces engineering costs, mitigates risk and reduces time to market. Engineers rely on the accuracy, capacity, and performance of HFSS to design high-speed components including on-chip embedded passives, IC packages, PCB interconnects, and high-frequency components such as antennas, RF/microwave components, and biomedical devices. The power of HFSS comes from many Ansoft pioneered research and development innovations. These breakthroughs have made HFSS the most widely used software for solving 3D full-wave electromagnetic field simulations.
Some of the exciting new features of HFSS V12.0 include:
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